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Archive: deadline passed on 07/16/2025

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Completed

Universität Stuttgart - Thermische Hardware-in-the-Loop (THiLo)

Buyer:
Universität Stuttgart
Region:
70569 Stuttgart, DEU
Published:
06/23/2025
Deadline
07/16/2025Expired

Timeline

  1. Published
  2. Submission deadline

Description

Die Universität Stuttgart beschafft ein System für thermische Hardware-in-the-Loop (THiLo) Simulationen. Das System dient zur Untersuchung thermischer Effekte in komplexen Systemen unter realen Betriebsbedingungen.

Lots (1)

  • Lot LOT-0000

    Thermische Hardware-in-the-Loop THiLo

Classification

CPV Codes
42511110-5Industriemaschinen
NUTS Codes
DE1

Details

Deadline
07/16/2025
Platform
Bund

Contact Information

Address
Universität StuttgartKeplerstraße 770174 StuttgartDEU

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