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Archive: deadline passed on 09/20/2024

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Completed

SAL - Thermokompressionsformanlage für Fan-out-Wafer-Level-Packaging

Buyer:
Silicon Austria Labs GmbH
Region:
Graz
Published:
08/19/2024
Deadline
09/20/2024Expired

Timeline

  1. Published
  2. Submission deadline

Description

Beschaffung einer Thermokompressionsformanlage (Thermo-compression molding) für die Pilotlinie für Fan-out-Wafer-Level-Packaging der SAL. Die Anlage dient der Herstellung von Fan-out-Wafer-Level-Packaging-Bauteilen. Die Förderung erfolgt durch die FFG.

Lots (1)

  • Lot LOT-1750

    TCWM - Thermocompression Wafer Molding

Classification

CPV Codes
38000000Labor- & Messgeräte
NUTS Codes
AT221

Details

Deadline
09/20/2024
Reference Number
2b2024
Platform
TED

Contact Information

Contact Person
Schramm Öhler Rechtsanwälte GmbH, zH RA Mag. Christian Gruber und RA Mag. David Melingo, Bartensteingasse 2, 1010 Wien
Phone
+43 14097609
Address
Silicon Austria Labs GmbHSandgasse 34GrazAUT

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